Packaging Process Engineer

Snap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together. The Company’s three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles.

The Spectacles team is pushing the boundaries of technology to bring people closer together in the real world. Our fifth-generation Spectacles, powered by Snap OS, showcase how standalone, see-through AR glasses make playing, learning, and working better together.

Snap’s camera supports real friendships through visual communication, self expression and storytelling. Moving forward, our camera will play a transformative role in how people experience the world around them, combining what they see in the real world, with all that’s available to them in the digital world.

We’re looking for a Packaging Process Engineer to join our team at Snap Inc!

What you’ll do:

This role will serve as the technical process owner for backend packaging processing supporting our advanced displays,  while owning supplier process design transfers from proto through production. As an engineer you drive process development, yield, and manufacturability across Specs’ various manufacturing sites and partners.  

Additionally you will: 

• Own and optimize backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.

• Act as the primary technical interface for equipment, materials, and manufacturing partners, overseeing tool qualification, process capability, build readiness, and issue resolution.

• Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.

• Lead structured problem solving (DOEs, FMEA, root cause analysis, corrective actions) for yield excursions, line stops, and parametric drifts across lithography and packaging.

• Partner with cross-functional teams to define capacity models, WIP/uptime strategies, and roadmap for next-generation display architectures, packaging schemes, and interconnect technologies.
  Translate complex process data, fab health metrics, and Supplier performance into clear recommendations and decision points for cross-functional stakeholders in hardware engineering, program management, and manufacturing operations.

Knowledge, Skills & Abilities:

• Strong expertise in backend assembly processes for advanced displays, including die attach, molding/encapsulation, marking, and final packing.

• Experience developing and sustaining wire bonding processes (materials, bond parameters, loop profiles, pad design interfaces) for high‑density LOCS packages.

• Working knowledge of optical lithography and photoresist processes in a microfab environment, and how front end choices interact with packaging assembly windows.

• Hands-on experience with relevant equipment sets across the processes (e.g.resist tracks, mask aligners, packing equipment) including recipe setup, tuning, and troubleshooting.

• Proven ability to function as a module owner in a high-volume fab or OSAT environment, balancing NPI design transfer activities and roadmap work.

• Exceptional problem solver with a structured, solution focused approach, leveraging advanced statistical tools to improve yield and stability in lithography and packaging.

• Comfortable working in ISO 5–6 cleanroom environments and enforcing best practices in contamination control, safety, and EHS compliance.

Minimum Qualifications:

• BS degree in Electrical Engineering, Materials Science or a related technical field

• 7+ years of experience as a process or packaging engineer in microfabrication fabs.

• Direct experience in processes such as die attach, wire bonding, molding/encapsulation, and final test for semiconductor or display packages.

• Demonstrated track record of improving yield and process stability through structured experimentation (DOE), SPC, and cross-functional problem solving.

• Experience planning and executing process transfers from R&D to production sites.

• International travel between Taiwan, U.S., and supplier sites (up to ~30%).

Preferred Qualifications:

• 10+ years of experience in photolithography process engineering and backend packaging.

• Ownership of  module performance and direct collaboration with applications engineers.

• Experience working directly with external manufacturing partners or customers in Asia.

• Excellent problem solver with a foundation in Six Sigma.

• Proficient in written and verbal communication in both Mandarin and English.

If you have a disability or special need that requires accommodation, please don’t be shy and provide us some information.

"Default Together" Policy at Snap: At Snap Inc. we believe that being together in person helps us build our culture faster, reinforce our values, and serve our community, customers and partners better through dynamic collaboration. To reflect this, we practice a “default together” approach and expect our team members to work in an office 4+ days per week. 

At Snap, we believe that having a team of diverse backgrounds and voices working together will enable us to create innovative products that improve the way people live and communicate. Snap is proud to be an equal opportunity employer, and committed to providing employment opportunities regardless of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, pregnancy, childbirth and breastfeeding, age, sexual orientation, military or veteran status, or any other protected classification, in accordance with applicable federal, state, and local laws. EOE, including disability/vets.

Our Benefits: Snap Inc. is its own community, so we’ve got your back! We do our best to make sure you and your loved ones have everything you need to be happy and healthy, on your own terms. Our benefits are built around your needs and include paid parental leave, comprehensive medical coverage, emotional and mental health support programs, and compensation packages that let you share in Snap’s long-term success!